15 {{ "2026-01-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-15T00:00:00+00:00" | date "longDate" }}

OMRON News

Miniature MOSFET relays target high-speed test switching

OMRON expands its G3VM range with 20 V and 40 V parts designed to reduce capacitance, leakage, and switching delays in high-channel ATE.

Read more…

15 {{ "2026-01-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-15T00:00:00+00:00" | date "longDate" }}

Northrop Grumman News

Accelerated Radiation Testing for Microelectronics

Northrop Grumman demonstrates compact radiation-testing technology under DARPA program to shorten qualification cycles for space and nuclear microelectronics.

Read more…

15 {{ "2026-01-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-15T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric samples new trench SiC-MOSFET bare dies

Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.

Read more…

15 {{ "2026-01-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-15T00:00:00+00:00" | date "longDate" }}

Microchip News

Military-Qualified Plastic TVS Devices for Harsh Environments

Microchip Technology introduces MIL-PRF-19500-qualified plastic transient voltage suppressors to address weight, cost, and reliability requirements in aerospace and defense electronics.

Read more…

14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-14T00:00:00+00:00" | date "longDate" }}

Parker News

Parker launches thin bond-line thermal greases for PCB cooling

Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.

Read more…

13 {{ "2026-01-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-13T00:00:00+00:00" | date "longDate" }}

Nvidia News

Life sciences adopt NVIDIA BioNeMo for AI drug discovery

NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.

Read more…

12 {{ "2026-01-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-12T00:00:00+00:00" | date "longDate" }}

Altech Corporation

Altech Announces Tough, IP67 Enclosures With Unique Seal System for Harsh Environments

Rugged Polycarbonate Housings Deliver Superior Protection Against Moisture, Dust, and Extreme Conditions.

Read more…

09 {{ "2026-01-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-09T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Launches Wi-Fi 7 Tri-Radio Platform for IoT

A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.

Read more…

09 {{ "2026-01-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-09T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Technology Delivers Custom Firmware to Power Secure System Control in NVIDIA DGX Spark AI Platforms

The new embedded controller firmware will strengthen secure boot, power sequencing and system orchestration for compact AI supercomputing environments.

Read more…

09 {{ "2026-01-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-09T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Live NR-NTN Validation in Band n252

Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Miniature MOSFET relays target high-speed test switching

OMRON expands its G3VM range with 20 V and 40 V parts designed to reduce capacitance, leakage, and switching delays in high-channel ATE.

Accelerated Radiation Testing for Microelectronics

Northrop Grumman demonstrates compact radiation-testing technology under DARPA program to shorten qualification cycles for space and nuclear microelectronics.

Mitsubishi Electric samples new trench SiC-MOSFET bare dies

Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.

Military-Qualified Plastic TVS Devices for Harsh Environments

Microchip Technology introduces MIL-PRF-19500-qualified plastic transient voltage suppressors to address weight, cost, and reliability requirements in aerospace and defense electronics.

Parker launches thin bond-line thermal greases for PCB cooling

Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.

Life sciences adopt NVIDIA BioNeMo for AI drug discovery

NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.

Altech Announces Tough, IP67 Enclosures With Unique Seal System for Harsh Environments

Rugged Polycarbonate Housings Deliver Superior Protection Against Moisture, Dust, and Extreme Conditions.

Infineon Launches Wi-Fi 7 Tri-Radio Platform for IoT

A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.

Microchip Technology Delivers Custom Firmware to Power Secure System Control in NVIDIA DGX Spark AI Platforms

The new embedded controller firmware will strengthen secure boot, power sequencing and system orchestration for compact AI supercomputing environments.

Live NR-NTN Validation in Band n252

Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.

International