16
'25
Written on
Conrad News
16
'25
Written on
IAR Group News
RISC-V Toolchain Support Advances Automotive Safety Software
IAR extends its embedded development platform to support automotive-grade RISC-V processor IP, enabling certified software development for safety-critical vehicle systems.
16
'25
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Melexis News
Melexis Introduces Micropower Linear Hall Sensor for Gaming, IoT, and Industrial Systems
The MLX90296 linear Hall-effect sensor combines ultra-low power consumption, digital filtering, and compact packaging to support precise motion sensing in battery-powered applications.
16
'25
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Keysight technologies News
Ku-Band NTN Handover Across Satellite Orbits
Keysight Technologies and KT SAT demonstrate a multi-orbit NR-NTN handover over a live Ku-band GEO satellite link, aligning with emerging 3GPP Rel-19 standards.
15
'25
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MIkroe News
FOC motor control board for embedded drives
MIKROE expands its motor control ecosystem with a compact solution for efficient BLDC drive control in automotive and industrial electronics.
12
'25
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TDK News
TDK introduces vibration-resistant hybrid polymer capacitors for demanding automotive & industrial systems
A new vibration-resistant variant of TDK’s B409x SMD hybrid polymer capacitors withstands up to 30 g, delivering stable performance for high-stress automotive and industrial electronics.
11
'25
Written on
Rutronik News
Ultra-low-voltage wireless SoC for compact medical wearables
Rutronik introduces a new Nordic Semiconductor SoC that enables miniaturized healthcare and sensing devices through low-voltage operation, high efficiency and integrated security features.
11
'25
Written on
TDK News
TDK Showcases Physical AI Technologies Advancing Smart Devices at CES 2026
At CES 2026, TDK demonstrates new sensor, power, and haptic platforms that strengthen AI-enabled consumer, automotive, and industrial systems while debuting its “In Everything, Better” brand identity.
11
'25
Written on
Infineon News
Infineon Expands CoolSiC Portfolio for Efficient Power Conversion
New 750 V G2 devices in Q-DPAK and D2PAK packages improve thermal behavior, switching efficiency, and gate-drive flexibility for automotive chargers and industrial power systems.
10
'25
Written on
Toshiba News
