08
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TDK News
08
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Southco. Inc.
Southco Develops High-Tolerance Blind Mate Mechanism for Next-Generation Liquid-Cooled Data Centers
Designed to compensate for installation deviations, vibration, and thermal expansion, the mechanism supports efficient liquid cooling deployment at scale.
08
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Keysight technologies News
AI Validation Framework for Safety-Critical Systems
Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.
08
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TDK News
TDK Expands High-Power AC-DC Portfolio with 4.5 kW Three-Phase Supply
The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.
08
'26
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innodisk
Innodisk Unveils the New Computing Series with the First EXMP-Q911 COM-HPC Mini Module
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
07
'26
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SK Hynix News
SK hynix Unveils Next-Generation AI Memory at CES 2026
From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.
07
'26
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Qualcomm News
Snapdragon X2 Plus Platform for Windows PCs
Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.
07
'26
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Silicon Labs News
Bluetooth Beacons for Cold Chain Monitoring
Silicon Labs and MOKOSMART advance temperature tracking for perishable logistics with real-time BLE sensors.
07
'26
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RealMan Robotics
RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026
A system-level platform spanning humanoid robotic arms, integrated joint modules, global remote operations, and open-sourced real-world data.
07
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Micron News
